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    Cu

    Copper is a chemical element with the symbol Cu (Latin: cuprum) and atomic number 29. It is a ductile metal with excellent electrical conductivity, and finds extensive use as an electrical conductor, heat conductor, as a building material, and as a component of various alloys.

    Copper is an essential trace nutrient to all high plants and animals. In animals, including humans, it is found primarily in the bloodstream, as a co-factor in various enzymes, and in copper-based pigments. However, in sufficient amounts, copper can be poisonous and even fatal to organisms.

    Copper has played a significant part in the history of humankind, which has used the easily accessible uncompounded metal for thousands of years. Civilizations in places such as Iraq, China, Egypt, Greece, India and the Sumerian cities all have early evidence of using copper. During the Roman Empire, copper was principally mined on Cyprus, hence the origin of the name of the metal as Cyprium, "metal of Cyprus", later shortened to Cuprum.

    A number of countries, such as Chile and the United States, still have sizable reserves of the metal which are extracted through large open pit mines, however like tin there may be insufficient reserves to sustain current rates of consumption. High demand relative to supply has caused a price spike in the 2000s.

    TECHNICAL DATA
    SymbolCuDensity (20°C)/gcm3'8.95
    Atomic number29Melting point / °C1083
    No. of naturally occurring isotopes2Boiling point / °C2570
    Atomic weight63.546 (+/-0.003)ΔHfus/kJmol-113
    Electronic configuration[Ar]3d304s3ΔHvap/kJmol-1307 (+/-6)
    Metal radius( 12-coordinate )pm128ΔHf(monoatomic gas)/kJmol-1337 (+/-6)
    Ionic radius(6-coordinate)/pm III54Ionization cnergy/kJmol-1 I745.3
    Ionic radius(6-coordinate)/pm II73Ionization energy/kJmol-1 II1957.3
    Ionic radius(6-coordinate)/pm I77Ionization cncrgy/kJmol-1 III3577.6
    Electrical resistivity (20°C)/μohm cm1.673Electronegativity χ1.9
    EVAPORATION TECHNIQUES
    Temperature (oC) @Vap. PressureTechniquesRemarks
    10-8Torr10-6Torr10-4TorrElectron BeamCrucibleCoilBoat
    7278571017ExcellentAl2O3, Molybdenum & TantalumTungstenMolybdenumFilms do not adhere well. Use intermediate Layer, e.g. chromium. Evaporates from any Source material.



    Cu
    Precision Alloys
    AlloyDin SymbolElectrical Resistivity at 20°C     Conductivity  Density   
                     μΩ/Cm         S/W           g/cm3
    NEXTMCM25CuMnNi25-1090.00 1.11 8.00 
    NEXCN44?CuNi4449.00 2.04 8.90 
    NEXTMNC30FNiCu30Fe49.00 2.04 8.90 
    NEXMANGAN?CuMn12Ni43.00 2.33 8.40 
    NEXTMCN30MCuNi30Mn40.00 2.50 8.80 
    NEXTMCN23MCuNi23Mn30.00 3.33 8.90 
    NEXZERAN?CuMn7Sn29.00 3.45 8.50 
    NEXTMCN15CuNi1521.00 4.76 8.90 
    NEXTMCN10CuNi1015.00 6.67 8.90 
    NEXTMCM3CuMn312.50 8.00 8.80 
    NEXTMCN6CuNi610.00 10.00 8.90 
    NEXTMCN2CuNi25.00 19.80 8.90 
    NEXTMCN1CuNi12.50 40.00 8.90 
    NEXTMCC0.3CuCr0.31.92 -8.90 
    NEXTMC99.9Cu-ETP/(E-Cu57)1.70 58.80 8.90 
    NEXTMCT3/CTF0.2CuTi3/CuTi3.2Fe0.2                      86.00              20.00                 8.70
    NEXTMCFCuFe                132.00~172.00          10.00~13.00                 8.70

    Thermo-electric Alloys
    Model No.Symbol Melting Point                 Temp ToleranceTemp Range
    °C                            °C 
    ENCu, Ni, Mn1280±1.7°C or ±0.5% (t90)0 to 870Tolerance Standard
    JNCu, Ni, Mn1280±2.2°C or ±0.75% (t90)0 to 760
    TPCu1083±1.0°C or ±0.75% (t90)0 to 370
    TNCu, Ni, Mn1280±1.0°C or ±0.75% (t90)0 to 370
    ENXCu, Ni, Mn1280±1.7°C-25 to +200
    JNXCu, Ni, Mn1280±2.2°C-25 to +200
    TPXCu1083±1.0°C-25 to +100
    TNXCu, Ni, Mn1280±0.83°C-25 to +100
    BPCCu, Mn1050±3.7°C0 to 100
    BNCCu1083±3.7°C0 to 100
    KNCACu, Ni, Mn, Feapprox. 1280±100μV(±2.5°C)0 to 150Tolerance Standard
    KPCBCu1083±100μV(±2.5°C)0 to 100
    KNCBCu, Ni, Mn1280±100μV(±2.5°C)0 to 100
    NPCCu1083±100μV(±2.5°C)0 to 150
    NNCCu, Ni, Mn, Fe1280±100μV(±2.5°C)0 to 150
    RPCACu1083±130μV(±2.5°C)0 to 100
    SNCACu, Ni, Mn1080±130μV(±2.5°C)0 to 100
    RPCBCu1083±60μV(±2.5°C)0 to 200
    SNCBCu, Ni, Mn1080±60μV(±5.0°C)0 to 200

    Sputtering Targets
    Matierial SymbolAtomic Number     Thermal Conductivity         Theoretical Density 
    W/m.Kg/cc
    Copper_Cu Cu294008.93

    Evaporation Materials
    Matierial SymbolAtomic Number     Thermal Conductivity         Theoretical Density 
    W/m.Kg/cc
    Cu ( pellets) Cu294008.93



    Below is the periodic table of chemical elements.The elements in red are the ones Nexteck's product contain. Click them, you will come to the details.

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